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产品参数

  • DSR1A-DSR1M
  • Features

    • Low profile space
    • Ideal for automated placement
    • Glass passivated chip junctions
    • Low forward voltage drop
    • Low leakage current
    • High forward surge capability
    • High temperature soldering:260℃/10 seconds at terminals
    • Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC

    Mechanical data

    • Case: JEDEC SOD-123FL molded plastic body over glass passivated chip
    • Terminals: Solder plated, solderable per J-STD-002B and JESD22-B102D
    • Polarity: Laser band denotes cathode end

    产品属性

    VRRM(V):50 to 1000
    I(AV)(A):1.0
    IFSM(A):25
    VF(V):1.1
    IR(uA):5.0
    trr(uS):-